Saturday, December 10, 2011

Re: [papercreters] Re: Slip Forming Question



Your electrical boxes should have weep holes in the bottoms, so if you seal them you should leave those open. It might be just as easy to wrap the electrical boxes with duct tape and just pour around them. It would probably be a good idea to turn off circuit breakers while pouring.

The pc might bond to the thin board if it is rough, and that would be good. I think I would test a small area of it with a spray bottle and see if it absorbs water and swells, or even starts coming apart. Pc stays wet for days at best.

You've got the idea with the forms. Leaving a lower board in place will not only help contain drips but will also give support if that part of the wall wants to sag a bit. After the lower sections have drained and set for a couple of days then sagging is unlikely.

On 12/10/2011 6:06 AM, trendawareness wrote:

 Thank you for the detailed reply.    The drainage from the molds shouldn't pose much of a problem, except around the electrical boxes.  I'll probably place some pre-formed PC around those and fill it in a non-conductive insulator.    However there's a thin board between the studs and the exterior aluminum siding.  I presume that's water resistant and it won't mind getting damp for half a day or so while the PC cures.  If not, should I set in a layer of thin plastic sheeting prior to the pour?  Also, you indicate that the PC will pull back from the forms as it cures.  My question is, when I pour on day 2 above day 1's pour, should I leave day 1's form in place to contain the slurry that may back-fill over where day 1 contracted?  In effect walking two 1' boards up the wall by moving day 1 up to day 3 and so on?  Thanks again!    


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