Thank you for the detailed reply.
The drainage from the molds shouldn't pose much of a problem, except around the electrical boxes. I'll probably place some pre-formed PC around those and fill it in a non-conductive insulator.
However there's a thin board between the studs and the exterior aluminum siding. I presume that's water resistant and it won't mind getting damp for half a day or so while the PC cures. If not, should I set in a layer of thin plastic sheeting prior to the pour?
Also, you indicate that the PC will pull back from the forms as it cures. My question is, when I pour on day 2 above day 1's pour, should I leave day 1's form in place to contain the slurry that may back-fill over where day 1 contracted? In effect walking two 1' boards up the wall by moving day 1 up to day 3 and so on?
Thanks again!
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